YCB-1 Smart Card Module Bonding Machine (INLAY machine)

Smart Card Module Bonding Machine 1.Adopts high-speed servo system and highly stable and precise spot welder with HF contravar

YCB-1 INLAY machine

 For watching the video clip of this machine, please visit our official website:

http://www.tj-lk.cn

http://www.tj-lk.cn/cpinfo.asp?id=475

Smart Card Module Bonding Machine  YCB-1   

This machine adopts high-speed servo system and highly stable and precise spot welder with HF contravariant resistance, which is characterized with high precision, high stability and high speed.

Technical parameters:

Applicable layout: 3*10, 4*10Applicable material (plastic material) :Plastic material like PVC, ABS, PETG etc.Applicable material (copper wire) :0.10-0.15mmNumber of weld head:1Work table: 1 worktable 410×520Control: PLC + touch screenSpot welder:1 set, 9kVACompressed air:0.6MPaAir consumption:5 liter/min.Power supply: AC380V, 3-phase with 5-wirePower:1.5kWWeight:400kgDimension: L1350×W960×H1750

 Smart Card Module Bonding Machine  YCB-1   

 Smart Card Module Bonding Machine  YCB-2

Our machines include:

contactless IC card processing equipment( Inlay machines),card laminator,card punching machine,SIM card making machines,special shape card punching machine (3-tag machine),hot stamping machine,magnetic strip spot bonding machine,spot bonding machine,personalized Data equipments, etc.

 please visit our official website: http://www.tj-lk.cn 

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YCB-1 Smart Card Module Bonding Machine (INLAY machine)